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2024-12-14 11:28:12

Domestic big model fierce battle video generation track domestic video big model broke out in a concentrated way. Recently, all kinds of funny videos made with AI big model became popular on the Internet. Behind this is the rapid rise of domestic video models, and the threshold of Wensheng video and Tusheng video has been greatly reduced. At the end of March this year, the "Dream AI" platform was tested internally, and the web version was opened in May, and it was officially put on the mobile terminal in August. On June 6th, official website, a large model of "Keling" video generation, was officially launched, and 15 days later, it announced the launch of graphic video function. Various video generation models of Internet vendors have mushroomed. On July 4th, Shangtang Technology released Vimi;, a large model of character video generation; On July 6, the online AI generated a clear image of the video model; On September 19, Alibaba Cloud Tongyi Wanxiang released a video generation model, which launched the functions of Wensheng video and Tusheng video. On December 3rd, the video generation function of Tencent Hybrid Model was launched. The industry believes that at present, the domestic large-scale video model has significantly improved the consistency, controllability and richness of the picture. After improving the imaging quality and breaking through the bottleneck of generation time, it is expected to greatly open up the downstream commercial space.China's assets ETF and China Stock Exchange rose by nearly 5% when they were rich, China's assets ETF and China Stock Exchange rose by nearly 5% when they were rich, and China's ETF rose by nearly 5% when they were rich three times. China's overseas Internet ETF rose by nearly 2%; Bili Bili rose nearly 4%, Xpeng Motors rose nearly 3%, Pinduoduo and Baidu rose over 2%, and Ali and Weilai rose nearly 2%.Treasury futures closed in early trading, with 2-year Treasury futures (TS) up 0.02%, 5-year Treasury futures (TF) up 0.04%, 10-year Treasury futures (T) up 0.09% and 30-year Treasury futures (TL) up 0.08%.


Indian Rupee's exchange rate against the US dollar fell below 84.86, a record low.The personal pension system has been extended to the whole country, and banks have issued assessment tasks: before the first quarter, each person must complete at least 20 accounts, and the personal pension system has been extended from 36 pilot cities (regions) to the whole country. The reporter learned that major banks have already laid out in advance in non-pilot areas and started the work of making an appointment to open an account for personal pension funds. A staff member of the personal finance department of a state-owned bank told reporters that with the full roll-out of the personal pension system, their bank is preparing for a 100-day attack. The staff also revealed that at present, the bank has issued specific task indicators to employees. "Each employee needs to complete about 20 to 30 account opening tasks, from now until the end of the first quarter of next year." (per meridian)Korean Air passed the US antitrust review, clearing the way for completing the Asiana Airlines transaction.


Market News: NVIDIA has increased its recruitment in China, focusing on artificial intelligence to drive cars.According to the data of Cat's Eye Professional Edition, the movie "Lone Star Project" was released for 6 days, and the total box office broke 70 million.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)

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